Author Details
Xu, Guipeng
| Issue | Section | Title | File |
| No 4 (2025) | Thermal methods | Infrared Thermal Imaging Detection and Image Segmentation of Micro-Crack Defects in Semiconductor Silicon Wafer Scanned by Laser |
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Keywords
Full Matrix Capture (FMC)
Total Focusing Method (TFM)
acoustic emission
antenna array
coercive force
composite
cracks
defect
flaw detection
image processing
infrared thermography
inverse problem
magnetic method
modeling
non-destructive testing
nondestructive testing
thermal testing
thickness measurement
ultrasonic inspection
ultrasonic testing
ultrasound
Information
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Pay with
User
Subscription
Login to verify subscription
Keywords
Full Matrix Capture (FMC)
Total Focusing Method (TFM)
acoustic emission
antenna array
coercive force
composite
cracks
defect
flaw detection
image processing
infrared thermography
inverse problem
magnetic method
modeling
non-destructive testing
nondestructive testing
thermal testing
thickness measurement
ultrasonic inspection
ultrasonic testing
ultrasound
Information